Name: Core Ultra 5 225F, Core Ultra 5, FCLGA1851,, 225F, 64-bit, Core Ultra (Serie
Brand: Intel
SKU: 53974719
Price: 241.53 CHF
Availability: InStock

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Intel

The Intel Core Ultra 5 225F processor is a powerful CPU designed for modern desktop applications and gaming. With a base frequency of 2.7 GHz and a maximum turbo frequency of up to 4.9 GHz, this processor delivers impressive performance for demanding tasks. The architecture is based on the Arrow Lake generation and supports the latest technologies, including DDR5 SDRAM and PCI Express 5.0. The integrated neural processing unit (NPU) with Intel AI Boost enables the execution of AI-driven applications and enhances overall processing speed. The processor supports up to 192 GB of RAM and offers a variety of features to improve security and efficiency, including Intel AES New Instructions and Intel Virtualization Technology. With a 20 MB cache and thermal monitoring technology, the Core Ultra 5 225F is suitable for use in both PCs and tablets.

- Neural processing unit (NPU) with Intel AI Boost for AI applications
- Support for up to 192 GB DDR5 SDRAM
- PCI Express 5.0 for faster data transfers
- Intel Deep Learning Boost for enhanced AI performance
- Thermal monitoring technologies to optimize energy efficiency.

Actual product image Intel Core Ultra 5 225F, Core Ultra 5, FCLGA1851,, 225F, 64-bit, Core Ultra (Serie (LGA 1851, 3.30 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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