Name: Core i7-870
Brand: Intel
SKU: 225621
Rating: 4.75 (4 reviews)

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Intel

The Intel Core i7-870 is a powerful processor designed for demanding applications and multitasking scenarios. With a base clock speed of 2.93 GHz and a maximum turbo frequency of 3.6 GHz, this processor delivers impressive performance, making it ideal for gaming, creative applications, and professional software. The architecture of the i7-870 is based on 45-nanometer technology and supports Hyper-Threading, which means it can handle up to eight threads simultaneously. This enhances efficiency and speed when executing multiple tasks. The processor features an LGA 1156 socket and supports dual-channel memory, increasing the bandwidth for RAM and optimizing overall system performance. Integrated Intel technologies such as AES-NI and VT-x provide additional security and virtualization features that are important for modern applications.

- 4 processor cores with Hyper-Threading for improved multitasking performance
- Maximum turbo frequency of 3.6 GHz for temporary performance boosts
- Support for dual-channel memory for higher bandwidth
- Integrated virtualization technologies (VT-x and VT-d) for efficient resource utilization
- Compatible with DDR3 RAM for modern memory solutions.

Actual product image Intel Core i7-870 (LGA 1156, 2.93 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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