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Intel

The power of Turbo Boost technology. For a seamless experience. Spend less time waiting and more time being productive with the performance and responsiveness of Turbo Boost Technology 2.0. Longer battery life and faster charging provide wireless freedom, allowing you to fully enjoy the enhanced speed and performance. Create, edit, and share 4K content effortlessly and experience immersive 4K and 360-degree full-screen display. In other words, Intel's best processor is now even better.

Attractive performance. With its strong responsiveness, the Intel® Core™ processor of the seventh generation has the power and speed needed to keep up with your demands. Files and programs open quickly, and you can switch seamlessly and without delay between applications and web pages.

Immersive entertainment. Experience Ultra HD content with the clarity and sharpness of 4K resolution. With 4x more pixels than Full HD screens, you get sharper and clearer images for an unparalleled, immersive experience.

User-friendly. Modern PCs are more user-friendly than ever – with facial recognition technology, you can log in quickly and easily, the PC is activated in 0.5 seconds, and the weight of these super-slim devices is minimized.

Actual product image Intel Core i5-7600K 3.80GHz LGA1151 6MB Cache Tray CPU (LGA 1151, 3.80 GHz, 4 -Core)

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Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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