Name: Xeon Lfd Qc X3470 2.93 Ghz 8M
Brand: HPE
SKU: 18058985
Price: 559 CHF
Availability: InStock

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The HPE Xeon Lfd QC X3470 processor is a powerful CPU designed for demanding applications and server environments. With a clock speed of 2.93 GHz and the ability to reach up to 3.6 GHz in Turbo mode, this processor delivers high computing power. It belongs to the Xeon family and supports up to 8 cores and 8 threads, enabling efficient processing of multiple tasks simultaneously. The processor architecture is 64-bit, ensuring improved performance when handling large amounts of data. The Xeon X3470 features a dual-channel memory architecture and supports up to 32 GB of DDR3 RAM, making it ideal for memory-intensive applications. With a maximum Thermal Design Power (TDP) of 95 watts, it is also energy-efficient and suitable for use in servers that require high availability.

- Processor architecture: 64-bit for enhanced data processing
- Maximum Turbo clock speed of 3.6 GHz for additional performance
- Supports virtualization technologies (VT-x and VT-d)
- Dual-channel memory architecture for optimized memory performance
- 8 MB L3 cache for faster access to frequently used data.

Actual product image HPE Xeon Lfd Qc X3470 2.93 Ghz 8M (LGA 1156, 2.93 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Number of threads

PCI express version (max.)

Item number

Xeon Lfd Qc X3470 2.93 Ghz 8M

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Intel Technologies

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