Name: Intel Xeon-Gold 6430 32-core Processor for
Brand: HPE
SKU: 32463635
Price: 2020 CHF
Availability: InStock

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The Intel Xeon Gold 6430 processor is a powerful CPU specifically designed for server and enterprise applications. With 32 cores and a base frequency of 2.1 GHz, this processor delivers high processing power necessary for demanding tasks in data centers and data processing. The maximum turbo frequency of 3.4 GHz allows for dynamic performance adjustment to maximize efficiency. The processor supports DDR5 RAM with a maximum memory speed of 4000 MHz, ensuring fast data processing and transfer. With a 60 MB L3 cache and support for up to 6 TB of RAM, the Xeon Gold 6430 is ideal for memory-intensive applications. The architecture of the processor is based on a 64-bit architecture and utilizes advanced technologies such as Hyper-Threading and Speed Shift to further optimize performance. The processor is designed for the LGA 4677 socket and has a thermal design power (TDP) of 270 W, making it a robust choice for modern server solutions.

- 32 cores with Hyper-Threading for enhanced multitasking performance
- Maximum memory support of 6 TB with DDR5 RAM
- 60 MB L3 cache for faster data access
- Support for PCI Express 5 for high bandwidth
- Optimized for server and enterprise applications with a thermal design power of 270 W.

Actual product image HPE Intel Xeon-Gold 6430 32-core Processor for (LGA 4677, 2.10 GHz, 32 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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