Name: AMD EPYC 9335 3.2-3.4GHz 32-core 210W Processor
Brand: HPE
SKU: 52234341
Price: 7889 CHF
Availability: PreOrder

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The AMD EPYC 9335 processor from Hewlett Packard Enterprise is a powerful CPU specifically designed for server-based applications. With 32 cores and a base clock frequency of 3.2 GHz, which can be boosted up to 3.4 GHz, this processor offers high processing power for demanding workloads. The architecture supports up to 64 threads, enabling efficient processing of multiple tasks simultaneously. The EPYC 9335 is equipped with a dodeca-channel memory interface that supports DDR5 SDRAM and provides a maximum memory bandwidth of 576 GB/s. These features make it ideal for memory-intensive applications and HPEC workloads. The processor is housed in an SP5 socket and has a maximum thermal design power (TDP) of 210 watts, making it a robust choice for modern server solutions.

- Maximum turbo clock frequency of 4.4 GHz for additional performance when needed
- 128 MB L3 cache to enhance data processing speed
- Support for PCI Express 5 for faster data transfers
- Optimized for memory-bound HPEC workloads
- 64-bit architecture for improved computing power and efficiency.

Actual product image HPE AMD EPYC 9335 3.2-3.4GHz 32-core 210W Processor (SP5, 3 GHz, 32 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Number of threads

PCI express version (max.)

Item number

AMD EPYC 9335 3.2-3.4GHz 32-core 210W Processor

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