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Actual product image HPE AMD EPYC 9224 KIT FOR CRA-STOCK (SP5, 2.50 GHz, 48 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Processor family	Epyc
Number of processor cores	48 -Core
Max. TDP	200 W
Number of threads	48
PCI express version (max.)	5
Item number	32728233

Manufacturer	HPE
Category	Processors
Manufacturer no.	P58782-B21
Release date	21.3.2023

Processor family	Epyc
Socket	SP5
Clock frequency	2.50 GHz
Max. turbo clock rate	3.70 GHz
Number of processor cores	48 -Core
Number of threads	48
Number of performance cores	48 -Core
Max. TDP	200 W
L3 Cache	64 MB
PCI express version (max.)	5

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HPE AMD EPYC 9224 KIT FOR CRA-STOCK

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HPE AMD EPYC 9224 KIT FOR CRA-STOCK

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