Name: Epyc 9654
Brand: AMD
SKU: 32402646
Price: 2652.2 CHF
Availability: InStock

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The AMD EPYC 9654 processor is a powerful solution for servers and workstations that require high computing performance. With 96 cores and 192 threads, this processor delivers impressive multithreading capabilities optimized for demanding applications and data processing. The base frequency of 2.4 GHz can be boosted up to 3.7 GHz, allowing for flexible adaptation to various workloads. The EPYC 9654 supports a 12-channel memory architecture with DDR5 RAM, ensuring high bandwidth and fast data processing. With a generous L3 cache of 384 MB, efficiency in data processing is further enhanced. The maximum power consumption of 360 watts and advanced 5nm technology provide optimal energy efficiency and performance.

- 12-channel memory support for DDR5-4800 MHz
- AMD Infinity Guard for enhanced security
- Optimized for server-based applications and data processing
- Supports PCI Express Version 5 for high data transfer rates
- Designed with a 5 nm process technology for improved energy efficiency.

Actual product image AMD Epyc 9654 (SP5, 2.40 GHz, 96 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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